Tuesday, June 1, 2010

Modern Electroplating (The ECS Series of Texts and Monographs) [Hardcover]

Rating: (3 reviews)
Author:
ISBN : 9780471168249
Buy New from $299.95
A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment
  • Series: The ECS Series of Texts and Monographs (Book 38)
  • Hardcover: 888 pages
  • Publisher: Wiley-Interscience; 4 edition (August 24, 2000)
  • Language: English
  • ISBN-10: 0471168246
  • ISBN-13: 978-0471168249
  • Product Dimensions: 1.5 x 7.2 x 10.2 inches
  • Shipping Weight: 3.4 pounds

Modern Electroplating

I have read through about a third of this book in an effort to update my electroplating knowledge and learn about some areas of electroplating I don't normally practice.

Generally speaking, this is an excellent review of the field and has been updated to include information on additive use in copper electroplating and developments in alloy electroplating for electronics.

On the downside, the editing of the book as a whole seems to be non-existent. The quality of individual chapters varies widely. This leaves me with the impression that Schlesinger and Paunovic only checked to see if the chapters were written in English and stopped at that point. Some chapters are a delight to read (like the chapter on palladium) while others are peppered with typographical errors, missing equations and such like things (e.g. the chapter on chromium). Also the varying values of Faraday's constant throughout the book indicates that no effort was made to enforce consistency of constants and units throughout the book. I was so irritated by this that I spent two or three hours finding out exactly what Faraday's constant should be (it's 96,485.3 Coulombs/mole). I found a good explanation of Faraday's constant on [...]
By Thomas E. Dinan
Muy completo y fácil de comprender. Una verdadera biblia del acabado de metales.
Muy recomendable, aunque está en inglés, como no podía ser de otra manera.
By G CLARISSE BARRAGAN JAIN
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